TL;DR
This paper reviews the challenges and current technologies in hybrid pixel detector systems, focusing on their integration, reliability, and cost-effectiveness for high-performance applications.
Contribution
It provides a comprehensive comparison of existing interconnection technologies and interface solutions for hybrid pixel detectors.
Findings
Current technologies vary in yield, reliability, and cost.
Trade-offs exist between mechanical stability and passive mass.
Optimal solutions depend on specific application requirements.
Abstract
Hybridization of pixel detector systems has to satisfy tight requirements: high yield, long term reliability, mechanical stability, thermal compliance and robustness have to go together with low passive mass added to the system, radiation hardness, flexibility in the technology end eventually low cost. The current technologies for the interconnection of the front-end chips and the sensor are reviewed and compared, together with the solutions for the interface to the far-end electronics.
Peer Reviews
No public reviews on file for this paper yet. If you reviewed it on a platform where reviews are public (OpenReview, ICLR, NeurIPS, ICML), you can paste yours below so the community can read it here.
Videos
No videos yet. Explain this paper in a talk, walkthrough, or lecture? Add one.