Application of Ultraviolet Fluorescence in Wafer Surface Cleaning Analysis
Zhongwei Pan(Department of Electrical Engineering, the City College of, the City University of New York), Richard Chin
TL;DR
This paper presents ultraviolet fluorescence (UVF) as an effective, sensitive, and versatile method for detecting metal impurities on silicon wafer surfaces, enhancing contamination control in wafer processing.
Contribution
It introduces UVF as a novel technique for silicon wafer contamination analysis, highlighting its advantages over existing methods.
Findings
UVF detects Fe, Cu, Ni, Na at room temperature.
UVF offers low detection limits and high sensitivity.
It enables simultaneous multi-element analysis.
Abstract
Ultraviolet fluorescence (UVF) is introduced as a novel and versatile method for the determination of the contamination of metal impurities on silicon wafer surfaces. The results given demonstrate the usefulness of UVF for contamination control in silicon wafer processing. The experiments show some main characteristic peaks such as Fe, Cu, Ni and Na at room temperature. Compared with other surface sensitive techniques, the main advantages of UVF are low detection limits, simultaneous multi-element analysis and high sensitivity (up to 109 Fe/cm2).
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Taxonomy
TopicsIndustrial Vision Systems and Defect Detection · Nanofabrication and Lithography Techniques · Surface Roughness and Optical Measurements