Structural and chemical embrittlement of grain boundaries by impurities: a general theory and first principles calculations for copper
A. Y. Lozovoi (1), A. T. Paxton (1), M. W. Finnis (2) ((1) Atomistic, Simulation Centre, School of Mathematics, Physics, Queen's University,, Belfast, U.K.; (2) Department of Materials, Imperial College of Science,, Technology, Medicine, London, U.K.)

TL;DR
This paper presents a first-principles theoretical framework and computational analysis demonstrating that impurity-induced embrittlement of copper grain boundaries is primarily due to structural size effects rather than electronic or chemical interactions.
Contribution
It introduces a general theory and computational approach to distinguish structural and chemical effects in impurity embrittlement of grain boundaries, challenging the electronic effect paradigm.
Findings
Bi and Na embrittle via size effects, not electronic charge transfer.
Ag does not embrittle, consistent with experiments.
Structural effects dominate the embrittlement process.
Abstract
First principles calculations of the Sigma 5 (310)[001] symmetric tilt grain boundary in Cu with Bi, Na, and Ag substitutional impurities provide evidence that in the phenomenon of Bi embrittlement of Cu grain boundaries electronic effects do not play a major role; on the contrary, the embrittlement is mostly a structural or "size" effect. Na is predicted to be nearly as good an embrittler as Bi, whereas Ag does not embrittle the boundary in agreement with experiment. While we reject the prevailing view that "electronic" effects (i.e., charge transfer) are responsible for embrittlement, we do not exclude the role of chemistry. However numerical results show a striking equivalence between the alkali metal Na and the semi metal Bi, small differences being accounted for by their contrasting "size" and "softness" (defined here). In order to separate structural and chemical effects…
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