Modeling metallic island coalescence stress via adhesive contact between surfaces
Steven C. Seel, Jeffrey J. Hoyt, Edmund B. Webb III, and Jonathan A., Zimmerman

TL;DR
This study models the stress generated during island coalescence in thin films using molecular simulations, revealing that existing models overestimate the coalescence stress and that barriers to coalescence can be overcome at room temperature.
Contribution
The paper introduces a molecular statics and dynamics based model for island coalescence stress, providing a more accurate prediction than previous models.
Findings
Coalescence can occur spontaneously or with barriers depending on initial separation.
Existing models overestimate the coalescence stress.
Room temperature can overcome modest coalescence barriers.
Abstract
Tensile stress generation associated with island coalescence is almost universally observed in thin films that grow via the Volmer-Weber mode. The commonly accepted mechanism for the origin of this tensile stress is a process driven by the reduction in surface energy at the expense of the strain energy associated with the deformation of coalescing islands during grain boundary formation. In the present work, we have performed molecular statics calculations using an embedded atom interatomic potential to obtain a functional form of the interfacial energy vs distance between two closely spaced free surfaces. The sum of interfacial energy plus strain energy provides a measure of the total system energy as a function of island separation. Depending on the initial separation between islands, we find that in cases where coalescence is thermodynamically favored, gap closure can occur either…
Peer Reviews
No public reviews on file for this paper yet. If you reviewed it on a platform where reviews are public (OpenReview, ICLR, NeurIPS, ICML), you can paste yours below so the community can read it here.
Videos
No videos yet. Explain this paper in a talk, walkthrough, or lecture? Add one.
