Pairs of Gold Electrodes with Nanometer Separation Performed over SiO$_2$ Substrates with a Molecular Adhesion Monolayer
Ajit K. Mahapatro, Subhasis Ghosh, and David B. Janes

TL;DR
This paper presents a room-temperature electromigration technique to create nanometer-scale gold electrode pairs on SiO2 substrates with a molecular adhesion monolayer, enabling the fabrication of single-molecule electronic devices.
Contribution
The study introduces a simple, room-temperature method for fabricating nanogaps using electromigration on gold wires with a molecular adhesion layer, avoiding low-temperature processes.
Findings
Achieved ~1 nm gaps between gold electrodes after electromigration.
Successfully fabricated and tested single-molecule junctions with 1,4-Benzenedimethanethiol.
Eliminated residual metal interlinks and simplified the fabrication process.
Abstract
Pairs of electrodes with nanometer separation (nano-gap) are achieved through an electromigration-induced break-junction (EIBJ) technique at room temperature. Lithographically defined gold (Au) wires are formed by e-beam evaporation over oxide coated silicon substrates silanized with (3-Mercaptopropyl)trimethoxysilane (MPTMS) and then subjected to electromigration at room temperature to create a nanometer scale gap between the two newly formed Au electrodes. The Si-O-Si covalent bond at the SiO surface and the Au-sulphur (Au-S) bond at the top evaporated Au side, makes MPTMS as an efficient adhesive monolayer between SiO and Au. Although the Au wires are initially 2m wide, gaps with length 1nm and width 5nm are observed after breaking and imaging through a field effect scanning electron microscope (FESEM). This technique eliminates the presence of any residual…
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Taxonomy
TopicsMolecular Junctions and Nanostructures · Advanced biosensing and bioanalysis techniques · Electrochemical Analysis and Applications
