Microelectronic interconnects based on carbon nanotubes
Franz Kreupl, Andrew P. Graham, Maik Liebau, Georg S. Duesberg, Robert, Seidel, Eugen Unger
TL;DR
This paper reviews the potential of carbon nanotubes as innovative interconnect materials in microelectronics, highlighting their properties, current status, and integration challenges.
Contribution
It provides a comprehensive overview of carbon nanotubes' suitability for interconnects and discusses the technical hurdles for their practical implementation.
Findings
Carbon nanotubes exhibit promising electrical properties for interconnects.
Current challenges include integration and manufacturing issues.
Research is ongoing to overcome these obstacles.
Abstract
Carbon nanotubes have emerged as a possible new material for electronic applications. They show promising characteristics for transistors as well as for interconnects. Here we review their basic properties and focus on the status of nanotubes with respect to their application as interconnects and discuss the challenges facing their integration.
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Taxonomy
TopicsCarbon Nanotubes in Composites · Conducting polymers and applications · Molecular Junctions and Nanostructures