Modeling of the Peeling Process of Pressure-sensitive Adhesive Tapes with the Combination of Maxwell Elements
Katsuhiko Sato, Akihiko Toda

TL;DR
This paper introduces an analytical viscoelastic model combining Maxwell elements to describe the peeling behavior of pressure-sensitive adhesive tapes, explaining the tape's profile and peel rate effects.
Contribution
It presents a novel simple analytical model using Maxwell elements to predict peeling dynamics and tape profile based on adhesive viscoelasticity.
Findings
Critical peel rates are identified.
Peel rate influences detachment behavior.
Model explains tape profile formation.
Abstract
A simple model for the peeling process of pressure-sensitive adhesive tape is presented. The model consists of linear springs and dashpots and can be solved analytically. Based on the modeling, the curved profile of the peeling tape is spontaneously determined in terms of viscoelastic properties of adhesives. Using this model, two experimental results are discussed: critical peel rates in the peel force and the peel rate dependence of the detachment process of adhesive from the substrate.
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