Effect of stress-triaxiality on void growth in dynamic fracture of metals: a molecular dynamics study
E. T. Sepp\"al\"a, J. Belak, R. E. Rudd

TL;DR
This study uses molecular dynamics simulations to investigate how stress-triaxiality influences void growth and fracture behavior in copper under high strain rates, revealing detailed mechanisms and thresholds relevant to dynamic fracture.
Contribution
It provides new insights into the atomistic mechanisms of void growth under different stress conditions and validates macroscopic assumptions with detailed simulation data.
Findings
Void growth thresholds align with experimental spall strength values.
Void evolution exhibits four distinct regimes: elastic, yielding, saturation, and failure.
Stress-triaxiality significantly accelerates void growth and influences fracture modes.
Abstract
The effect of stress-triaxiality on growth of a void in a three dimensional single-crystal face-centered-cubic (FCC) lattice has been studied. Molecular dynamics (MD) simulations using an embedded-atom (EAM) potential for copper have been performed at room temperature and using strain controlling with high strain rates ranging from 10^7/sec to 10^10/sec. Strain-rates of these magnitudes can be studied experimentally, e.g. using shock waves induced by laser ablation. Void growth has been simulated in three different conditions, namely uniaxial, biaxial, and triaxial expansion. The response of the system in the three cases have been compared in terms of the void growth rate, the detailed void shape evolution, and the stress-strain behavior including the development of plastic strain. Also macroscopic observables as plastic work and porosity have been computed from the atomistic level. The…
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