Towards a quantitative phase-field model of two-phase solidification

TL;DR

This paper develops a quantitative phase-field model for two-phase solidification that accurately reproduces classical interface behavior and explores the effects of interface thickness on complex junction dynamics.

Contribution

It introduces a diffuse-interface model that matches classical free boundary problems and investigates diffuse multiple-junction dynamics in solidification.

Findings

Good accuracy for steady-state lamellae

Interface thickness affects limit cycle behavior

Highlights the importance of junction dynamics

Abstract

We construct a diffuse-interface model of two-phase solidification that quantitatively reproduces the classic free boundary problem on solid-liquid interfaces in the thin-interface limit. Convergence tests and comparisons with boundary integral simulations of eutectic growth show good accuracy for steady-state lamellae, but the results for limit cycles depend on the interface thickness through the trijunction behavior. This raises the fundamental issue of diffuse multiple-junction dynamics.