A possible solution of the grain boundary problem for applications of high-Tc superconductors

TL;DR

This paper proposes a threefold approach involving grain alignment, doping, and architecture optimization to significantly enhance the critical current density in high-Tc superconductor wires, aiming for competitive applications.

Contribution

It introduces a model-based method to improve high-Tc superconductor performance through specific microstructural strategies.

Findings

Critical current density can reach 4x10^6 A/cm2 at 77K with 10-degree grain alignment.

The approach offers a pathway to develop competitive high-Tc superconducting cables.

Model calculations support the effectiveness of the proposed microstructural optimizations.

Abstract

It is shown that the critical current density of high-Tc wires can be greatly enhanced by using a threefold approach, which consists of grain alignment, doping, and optimization of the grain architecture. According to model calculations, current densities of 4x10^6 A/cm2 can be achieved for an average grain alignment of 10 degree at 77K. Based on this approach, a road to competitive high-Tc cables is proposed.