# The Investigation of the Effect of Filler Sizes in 3D-BN Skeletons on Thermal Conductivity of Epoxy-Based Composites

## TL;DR

This paper explores how different sizes of boron nitride fillers affect the thermal conductivity of epoxy composites for use in microelectronics.

## Contribution

The study introduces a new environmentally friendly method to enhance thermal conductivity in epoxy composites using 3D-BN frameworks.

## Key findings

- Epoxy composites with larger BN fillers achieved a through-plane thermal conductivity of 2.01 W/m·K.
- The composites maintained a low dielectric constant of 3.7 and dielectric loss of 0.006 at 50 Hz.

## Abstract

Thermally conductive and electrically insulating materials have attracted much attention due to their applications in the field of microelectronics, but through-plane thermal conductivity of materials is still low at present. In this paper, a simple and environmentally friendly strategy is proposed to improve the through-plane thermal conductivity of epoxy composites using a 3D boron nitride (3D-BN) framework. In addition, the effect of filler sizes in 3D-BN skeletons on thermal conductivity was investigated. The epoxy composite with larger BN in lateral size showed a higher through-plane thermal conductivity of 2.01 W/m·K and maintained a low dielectric constant of 3.7 and a dielectric loss of 0.006 at 50 Hz, making it desirable for the application in microelectronic devices.