# Novel Polyarylene Ether Nitrile/BaTiO3-Decorated WS2 Nanohybrid Crosslinked Nanocomposites for Thermal-Stable Dielectrics

## TL;DR

Scientists created a new type of heat-resistant composite film using special nanomaterials, which could be useful for high-temperature electronics.

## Contribution

A novel three-dimensional nanofiller (WS2@BT) was developed to enhance compatibility and performance of dielectric composites at high temperatures.

## Key findings

- The CPEN/WS2@BT nanocomposite achieved a glass transition temperature of 257.83 °C at 30 wt% filler content.
- The dielectric constant of CPEN/WS2@BT was 193% higher than pure CPEN.
- The dielectric temperature coefficient remained below 1 × 10−3 °C−1 from 25–220 °C.

## Abstract

To prepare high-temperature-resistant dielectric composite films, a novel three-dimensional nanofiller was fabricated using carboxylated polyarylene ether nitrile as a bridge, which tightly loads BaTiO3 nanoparticles onto WS2 nanosheets (WS2@BT) via in situ chemical bonding. Afterward, the WS2@BT nanofiller was introduced into the polyarylene ether nitrile (PEN) matrix, and high-temperature heat treatment was performed to form a crosslinked network, yielding CPEN/WS2@BT nanocomposites. Notably, the modified WS2@BT effectively improves the compatibility between the nanoparticles and the PEN matrix, which is superior to the compatibility of unmodified nanofillers with the matrix. Moreover, after crosslinking, CPEN/WS2@BT exhibits excellent comprehensive performance: when the filler content is 30 wt%, its glass transition temperature (Tg) reaches 257.83 °C, significantly higher than that of PEN/WS2@BT, and its dielectric constant is 193% higher than that of pure CPEN. In addition, the dielectric temperature coefficient remains below 1 × 10−3 °C−1 in the range of 25–220 °C. Overall, this work provides an effective and reliable strategy for preparing high-performance, high-temperature-resistant composite dielectric films.