# Design and Fabrication of a Dual-Axis MEMS Electrostatic Micromirror Based on a Planar Comb Drive

**Authors:** Mumu Li, Wenlong Jiao, Kun Huang, Botao Wang, Zhihua Dai, Yang Gao, Huiliang Cao, Huikai Xie

PMC · DOI: 10.3390/mi17030278 · Micromachines · 2026-02-24

## TL;DR

This paper presents a MEMS micromirror that can move in two axes using a simplified fabrication method and achieves a wide scanning range.

## Contribution

The novel contribution is a dual-axis MEMS micromirror design using planar comb drives and an indirect simulation method to improve fabrication accuracy.

## Key findings

- The fabricated micromirror achieves a 26°×22° field of view at 35 V.
- An indirect simulation method was validated with minimal deviation from experimental results.
- Process optimization improved wafer cleanliness and reduced time costs.

## Abstract

This paper designs and fabricates an electrostatic-driven dual-axis MEMS micromirror capable of out-of-plane torsional motion about both the X and Y axes. Both torsional axes employ planar comb structures for their drive mechanisms, effectively reducing the fabrication complexity. By leveraging the structural asymmetry introduced during processing in conjunction with resonant operating modes, the inherent disadvantage of planar comb structures for torsional motion is overcome. This study explores the operating principle, structural design, performance simulation, fabrication process, and testing of the micromirror. It proposes an indirect simulation method suitable for planar comb drive structures, providing theoretical support for device fabrication. During fabrication, optimising the removal of isolation material through oxygen–silicon growth enhances the reliability of subsequent processes. Test results demonstrate that the fabricated MEMS micromirror achieves a 26°×22° field of view at a 35 V drive voltage, outputting Lissajous-type scanning patterns. This design aims to propose an indirect simulation method and optimise the process accordingly. Experimental test results show that the simulation method is relatively accurate, with minimal deviation from actual tests. Process optimization improves wafer cleanliness and reduces the time cost of the corresponding process.

## Full-text entities

- **Chemicals:** silicon (MESH:D012825), oxygen (MESH:D010100)

## Full text

_Full body text omitted from this summary view._ Fetch the complete paper as Markdown: https://tomesphere.com/paper/PMC13028193/full.md

## Figures

22 figures with captions in the complete paper: https://tomesphere.com/paper/PMC13028193/full.md

## References

35 references — full list in the complete paper: https://tomesphere.com/paper/PMC13028193/full.md

---
Source: https://tomesphere.com/paper/PMC13028193