# High-Efficiency and Low-Defect Removal Mechanism of Silicon Carbide Using Center-Inlet Computer-Controlled Polishing

## TL;DR

A new polishing method for silicon carbide improves efficiency and reduces defects by controlling liquid flow during the process.

## Contribution

Introduces center-inlet computer-controlled polishing to achieve high efficiency and low defects in silicon carbide fabrication.

## Key findings

- Center-inlet polishing reduces defect density and increases removal efficiency compared to non-center-inlet methods.
- Pit defects result from combined force and heat effects, which are minimized under center-inlet conditions.
- Center-inlet CCP suppresses processing heat and ensures stable friction, leading to high-quality surfaces.

## Abstract

Reaction-bonded silicon carbide (RB-SiC) is the preferred material for space optical systems because of its low density and high specific stiffness. However, its hardness and multi-component properties lead to low efficiency and pit defects during the polishing process, making the fabrication of RB-SiC a significant challenge. This study proposes a high-efficiency and low-defect fabrication method for RB-SiC using center-inlet computer-controlled polishing (CCP). We first investigated the polishing efficiency and surface quality achieved with center-inlet and non-center-inlet liquids. The results show that the defect density under non-center-inlet conditions was positively correlated with process parameters, while fewer defects and higher efficiency could be achieved under center-inlet conditions. Additionally, the efficient removal and defect suppression mechanisms under the center-inlet condition were revealed based on machining force, heat, and defect characterization. Under center-inlet conditions, the friction coefficient is larger and stable, resulting in high removal efficiency. The macro–micro coupled analysis results show that pit defects are generated through the combined action of force and heat, which leads to the thermo-mechanical degradation and shedding of SiC particles due to the temperature increase in the machining zone. The results demonstrate that center-inlet CCP not only ensures sufficient abrasion at the polishing interface to achieve high removal efficiency but also significantly suppresses the processing heat, thereby resulting in a low-defect surface.