Effect of Tourmaline Nanoparticles on Thermal, Mechanical, and Electrical Properties of Epoxy Resin Nanocomposites
Jinbo Yang, Hui Zhang, Yongping Chen, Rentong Yu

TL;DR
Tourmaline nanoparticles improve epoxy resin's mechanical strength and electrical insulation while reducing dielectric loss.
Contribution
Tourmaline nanoparticles provide stiffness-dominated reinforcement and reduce dielectric loss in epoxy composites.
Findings
Flexural modulus increased from 2.585 to 4.07 GPa with tourmaline addition.
Tourmaline at 5 phr improved flexural and impact strength by 5.02% and 57.4%.
Dielectric loss tangent decreased by 29.6% at 5 phr tourmaline.
Abstract
Tourmaline nanoparticle-reinforced DGEBA/MTHPA epoxy nanocomposites were developed to obtain mechanically robust insulating materials with reduced dielectric loss. Composites containing 0–20 phr tourmaline were prepared by mechanical mixing, vacuum degassing, and stepwise curing, and FTIR verified successful curing and network formation. Tourmaline delivered stiffness-dominated reinforcement, increasing the flexural modulus from 2.585 to 4.07 GPa. At 5 phr, the composites reached simultaneous maxima in flexural strength and impact strength, corresponding to improvements of 5.02% and 57.4% over the unfilled resin, respectively. Moreover, the modified epoxy thermosets still maintained excellent Tg and thermal decomposition temperature. Electrical insulation improved concurrently, as volume resistivity increased from 1.36 × 1016 Ω·cm for EP-0 to 1.89 × 1016 Ω·cm for EP-20, and surface…
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Taxonomy
TopicsEpoxy Resin Curing Processes · High voltage insulation and dielectric phenomena · Dielectric materials and actuators
