Effects of Cu Content on the Corrosion Resistance of CuxCoCrMoNi High-Entropy Alloy

TL;DR

This study examines how varying copper content affects the corrosion resistance of a high-entropy alloy in a salt solution.

Contribution

The novel finding is that higher copper content in the alloy reduces corrosion resistance by altering passive film composition.

Findings

Increasing copper content raises corrosion current density and lowers charge transfer resistance.

Higher copper levels in the alloy lead to more copper oxides and fewer chromium oxides in the passive film.

All alloys show n-type semiconductor behavior with increasing donor density as copper content rises.

Abstract

In this study, the corrosion behavior of CuXCoCrMoNi (x = 0.3, 0.6, 0.9) high-entropy alloys (HEAs) in 3.5% NaCl solution is systematically investigated. The alloy samples show a strong link between copper content and corrosion resistance. It is noteworthy that an increase in copper content promotes element segregation, resulting in an increase in corrosion current density from 2.138 × 10−7 μA/cm2 to 1.8989 × 10−6 μA/cm2 and a decrease in charge transfer resistance from 182.6 Ω·cm2 to 42.34 Ω·cm2. In addition, electrochemical experiments demonstrate that lowering the copper content in the alloys reduces the spread and depth of corrosion. All alloys exhibit n-type semiconductor behavior, with donor density increasing from 4.792 × 1023 cm−3 to 5.581 × 1023 cm−3 with increasing copper content. Notably, the passive film is characterized by the presence of Cr2O3 and Cu2O as its main constituents. As the copper content in the HEA increases, higher levels of copper oxides in the passive film inhibit the formation of chromium oxides. This degrades the passive film quality, thereby diminishing the overall corrosion resistance.

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