# Preparation Strategies of V-SiO2@NN Core Shell Structures for the Enhancement of PDCPD Composites

## TL;DR

This paper introduces a new V-SiO2@NaNbO3 core-shell structure that enhances the thermal, mechanical, and dielectric properties of PDCPD composites for advanced electronic applications.

## Contribution

A novel vinyl-functionalized core-shell structure is developed to improve PDCPD compatibility and performance for high-value electronic uses.

## Key findings

- 1.0 wt% VSN loading increases heat deflection and glass transition temperatures to 139.3 °C and 150.43 °C.
- The dielectric constant reaches 4.13 with an ultralow loss of 0.035% at 1 kHz.
- Composites retain high mechanical strength and solvent resistance.

## Abstract

Polydicyclopentadiene (PDCPD), an emerging environmentally friendly material, has been widely applied in lightweight structural shells; however, its extension to high-value electronic applications remains challenging. In this work, we developed a novel vinyl-SiO2@NaNbO3 (VSN) core–shell structure with a high surface vinyl concentration (1.26 mmol/g) and excellent thermal stability, making it highly suitable for co-polymerization with polymers. Through ring-opening metathesis polymerization, the influence of VSN on the mechanical, thermal, and dielectric properties of PDCPD composites was systematically investigated. The vinyl groups on the VSN surface provide strong interfacial compatibility with the PDCPD matrix. With only 1.0 wt% loading, the composites show significant performance improvements: the heat deflection temperature and glass transition temperature increased to 139.3 °C and 150.43 °C, respectively, while the dielectric constant at 1 kHz rises to 4.13 with an ultralow dielectric loss of 0.035%. Meanwhile, the composites maintain high mechanical strength and solvent resistance. This study not only establishes a facile strategy for fabricating highly compatible inorganic additives but also offers new opportunities for expanding PDCPD into advanced dielectric and electronic applications.