High-Sensitivity Defect Inspection for Unpatterned Wafers via Integrating Dark-Field Scattering and Diffraction Phase Microscopy
Xiangchao Zhang, Qianru Zheng, Di Li, Ruifang Ye
TL;DR
A new optical system combines two imaging techniques to detect tiny defects on semiconductor wafers with high sensitivity and accuracy.
Contribution
A dual-channel optical system integrating dark-field scattering and diffraction phase microscopy for enhanced defect detection.
Findings
The system achieves a detection limit of 60 nm for wafer defects.
It improves sensitivity compared to single dark-field scattering systems.
The system maintains high efficiency for small-scale defect inspection.
Abstract
To overcome the limitations in the sensitivity and reliability of conventional wafer defect inspection techniques, a novel dual-channel optical inspection system is proposed by combining dark-field scattering with diffraction phase microscopy. Such an integrated system simultaneously acquires dark-field intensity and phase gradient signals arising from wafer defects, enabling comprehensive defect characterization at identical wafer locations while maintaining high sensitivity and high efficiency. Experimental validation using polystyrene particles demonstrates that the system achieves a limit of detection of 60 nm, improves the detecting sensitivity compared to single dark field scattering systems, and maintains the lateral/vertical limit of detection for small-scale defects. These results confirm its potential to meet the high-sensitivity and high-reliability requirements of…
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Taxonomy
TopicsSurface Roughness and Optical Measurements · Optical Coatings and Gratings · Industrial Vision Systems and Defect Detection