# High-Voltage 4H-SiC PiN Diodes: Ion Implantation vs. Epitaxial Growth for Wide-Temperature Operation

**Authors:** Alfio Samuele Mancuso, Saverio De Luca, Enrico Sangregorio, Annamaria Muoio, Erik Gallo, Silvia Vanellone, Eleonora Quadrivi, Antonio Trotta, Lucia Calcagno, Salvo Tudisco, Francesco La Via

PMC · DOI: 10.3390/ma19040699 · Materials · 2026-02-12

## TL;DR

This study compares two types of 4H-SiC diodes to see how their fabrication methods affect performance at high temperatures.

## Contribution

The study reveals how anode fabrication methods impact the thermal stability and electrical performance of 4H-SiC diodes.

## Key findings

- Diodes with ion-implanted p+ anodes show greater temperature-dependent degradation in reverse bias.
- Forward I–V characteristics remain similar across both diode designs over a wide temperature range.
- Epitaxial p+ anodes demonstrate better thermal stability and electrical performance in harsh environments.

## Abstract

This study investigates the electrical performance of two 4H-SiC p+-i-n− diodes, based on lightly doped epitaxial layers, representative of high-voltage and neutron-detector structures. Each design was implemented in multiple nominally identical devices and characterized over the temperature range 298–623 K, with particular attention to the influence of p+ layer fabrication, n-type epitaxial layer thickness, and doping concentration. One diode features an ion-implanted p+ layer on a 250 µm thick n-type epitaxial layer, while the other employs an epitaxially grown p+ layer on a 100 µm thick n-type epitaxial layer. A comparison of reverse-bias Current–Voltage (I–V) and Capacitance–Voltage (C–V) characteristics indicates that, although both designs exhibit high-quality epitaxial 4H-SiC material, devices with an implanted p+ anode tend to show a more pronounced temperature-dependence and degradation of selected electrical parameters in reverse bias than those with an epitaxial p+ anode, while forward I–V in the range 298–623 K remains broadly similar for both designs. These observations suggest that anode fabrication and epitaxial design may jointly influence thermal stability, recombination mechanisms, and overall electrical performance, offering guidance for the optimization of 4H-SiC-based power and neutron-detector devices for high-temperature and harsh environments.

## Full-text entities

- **Diseases:** injury to (MESH:D014947), CVD (MESH:D019966)
- **Chemicals:** tritium (MESH:D014316), P+ (MESH:D010758), oxygen (MESH:D010100), TCS (MESH:C065893), ethylene (MESH:C036216), Ni (MESH:D009532), N (MESH:D009584), nickel silicide (MESH:C506609), C (MESH:D002244), Ag (MESH:D012834), Ge (MESH:D005857), chloride (MESH:D002712), H2 (MESH:D003903), Si (MESH:D012825), 4H (-), Al (MESH:D000535), GaAs (MESH:C043055), SiO2 (MESH:D012822), NA (MESH:D012964), Ti (MESH:D014025), chlorine (MESH:D002713), SiC (MESH:C022088), oxide (MESH:D010087)
- **Species:** Homo sapiens (human, species) [taxon 9606]
- **Cell lines:** SiC250 — Homo sapiens (Human), Finite cell line (CVCL_L952), SiC100 — Equus caballus (Horse), Transformed cell line (CVCL_C4M8)

## Full text

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## Figures

9 figures with captions in the complete paper: https://tomesphere.com/paper/PMC12942552/full.md

## References

52 references — full list in the complete paper: https://tomesphere.com/paper/PMC12942552/full.md

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Source: https://tomesphere.com/paper/PMC12942552