Single-Die-Level MEMS Post-Processing for Prototyping CMOS-Based Neural Probes Combined with Optical Fibers for Optogenetic Neuromodulation
Gabor Orban, Alberto Perna, Matteo Vincenzi, Raffaele Adamo, Gian Nicola Angotzi, Luca Berdondini, João Filipe Ribeiro

TL;DR
This paper introduces a new MEMS post-processing method for CMOS neural probes that can be combined with optical fibers for optogenetics, enabling high-resolution brain monitoring.
Contribution
A MEMS post-processing workflow for CMOS dies is developed, enabling material modification and layout shaping for neural probes.
Findings
Spray-coating photolithography methods were optimized to suppress edge effects on small substrates.
A 512-channel neural probe with a photoelectric shield was fabricated and showed >96% light-shielding effectiveness.
In vivo experiments confirmed the probe's high-resolution electrophysiological measurement capability.
Abstract
The integration of complementary metal–oxide–semiconductor (CMOS) and micro-electromechanical systems (MEMSs) technologies for miniaturized biosensor fabrication enables unprecedented spatiotemporal resolution in monitoring the bioelectrical activity of the nervous system. Wafer-level CMOS technology incurs high costs, but multi-project wafer (MPW) runs mitigate this by allowing multiple users to share a single wafer. Still, monolithic CMOS biosensors require specialized surface materials or device geometries incompatible with standard CMOS processes. Performing MEMS post-processing on the few square millimeters available in MPW dies remains a significant challenge. In this paper, we present a MEMS post-processing workflow tailored for CMOS dies that supports both surface material modification and layout shaping for intracortical biosensing applications. To address lithographic…
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Taxonomy
TopicsPhotoreceptor and optogenetics research · Neuroscience and Neural Engineering · CCD and CMOS Imaging Sensors
