# Evaluation of Copper Incorporation into Titanium via Ion Plating Diversified: Morphological, Structural, and Preliminary Biological Assessment

## TL;DR

This study evaluates copper incorporation into titanium implants using ion plating and finds that it does not effectively create antimicrobial surfaces.

## Contribution

The study provides physical limitations of low-energy ion plating for antimicrobial titanium surfaces.

## Key findings

- Copper was homogeneously incorporated into titanium surfaces at 0.3 wt% using ion plating.
- Copper implantation did not reduce corrosion resistance of titanium.
- Copper ions did not reach the surface or inhibit Staphylococcus aureus growth.

## Abstract

Surface contamination
of titanium-based implants by microorganisms
remains a major clinical challenge. In this study, grade 1 titanium
substrates were modified by low-energy ion plating diversified (IPD)
with copper ions at 3 keV and 7 keV to evaluate their morphological,
structural, and preliminary biological behavior. Characterization
by SEM, EDS, and XRF confirmed homogeneous copper incorporation, with
similar concentrations (∼0.3 wt %) for both energies. SRIM
simulations indicated Gaussian implantation profiles with peak concentrations
at 4 nm and 6 nm below the surface, respectively. Salt spray testing
showed that copper implantation did not impair the corrosion resistance
of titanium. However, biological assays using Staphylococcus
aureus revealed no inhibitory halos or significant
cell death, indicating that copper ions implanted at these energies
do not reach the surface or diffuse into the medium. These findings
define the physical limitations of low-energy IPD for antimicrobial
surface design, providing helpful guidance for future process optimization.