# A review of self-healing mechanisms for the application of conductive electronic products

## TL;DR

This review explores self-healing materials for electronics, which can repair themselves to improve durability and reduce waste.

## Contribution

The paper provides a comprehensive overview of intrinsic and extrinsic self-healing mechanisms in conductive electronic systems.

## Key findings

- Extrinsic self-healing uses microcapsules or vascular systems to deliver healing agents.
- Intrinsic healing relies on reversible bonds like hydrogen bonding and metal coordination.
- Self-healing materials enhance reliability in flexible electronics and wearable devices.

## Abstract

The rapid growth of electronic devices has raised concerns about durability and e-waste. Self-healing materials offer a promising solution by extending device lifespan and reducing maintenance needs. This review examines the use of self-healing materials in conductive electronic systems, focusing on intrinsic and extrinsic mechanisms. Extrinsic methods use microcapsules or vascular systems to release healing agents, while intrinsic approaches rely on reversible bonds, such as hydrogen bonding, ionic interactions, and metal coordination, to enable repeatable repair. Applications discussed include strain sensors, energy storage, and flexible electronics. The review highlights how these materials improve reliability in wearable devices, energy harvesters, and wireless systems. Critical factors affecting healing performance, like healing time, environment, and material design, are also analyzed. This review serves as a useful reference for selecting suitable self-healing strategies for next-generation electronic applications.

This review introduces intrinsic and extrinsic self-healing electronic materials. Dynamic bonds and healing agents restore function after damage, enabling durable flexible sensors, wearable electronics, and energy devices.