# Curcumin-Based Tri-Allyl Derivative for Bismaleimide Resins: Synergistic Modulation of Thermal Stability and Fire Safety

## TL;DR

A curcumin-based compound is used to improve thermal stability and fire safety in bio-based resins for aerospace and electronics.

## Contribution

A tri-allyl curcumin derivative is introduced as a bio-based crosslinker to enhance BMI resins' thermal and fire properties.

## Key findings

- The optimized formulation BA-0.87 achieves a Tg above 400 °C and 43.06% char at 800 °C.
- BA-0.87 reduces peak heat release rate by 13.2% compared to conventional BDM/DABPA resins.
- The curcumin derivative increases crosslink density and promotes char formation during decomposition.

## Abstract

Bio-based bismaleimide (BMI) resins can reduce environmental impact and impart intrinsic flame retardancy, but achieving a high glass transition temperature (Tg) remains challenging. Here, we replace the conventional petrochemical co-monomer O,O′-diallyl bisphenol A (DABPA) with a synthesized tri-allyl derivative of curcumin (AEC) in 4,4′-bismaleimidodiphenylmethane (BDM)-based resins. The AEC monomer, synthesized via exhaustive O- and C-alkylation of curcumin, acts as a trifunctional crosslinker. By systematically varying the imide:allyl molar ratio, we optimized the network properties. We optimize the network’s thermal and fire-safety properties. The optimized formulation (BDM: AEC = 1:0.87, denoted BA-0.87) yields 43.06% char at 800 °C and reduces the peak heat release rate (PHRR) by 13.2% compared to the conventional BDM/DABPA control (BD-0.87). Meanwhile, BA-0.87 passes UL-94 V-0 with no dripping and attains a Tg above 400 °C—nearly 100 °C higher than BD-0.87. These enhancements arise from curcumin’s rigid conjugated structure, which increases crosslink density and promotes char formation during decomposition. Our work demonstrates a viable, bio-derived pathway to engineer BMI resins that simultaneously improve thermal stability and intrinsic flame retardancy. Such resins are promising for demanding aerospace and high-temperature electronic applications that require both fire safety and stability.