# Characteristics of Pulsed-Laser-Induced Layers with Cracks Prepared for SiC Grinding Processes

## TL;DR

This paper shows that laser-induced cracks on silicon carbide surfaces can be controlled to reduce grinding force and improve surface quality during grinding processes.

## Contribution

The novel contribution is demonstrating how pulsed laser parameters can be systematically adjusted to control crack dimensions and reduce grinding energy in brittle materials like SiC.

## Key findings

- Laser-induced cracks reduced grinding force by 30% and specific grinding energy.
- Crack dimensions (20.4–54.3 μm) were controllable and inhibited crack propagation during grinding.
- Laser modification reduced ceramic surface hardness by about 20%.

## Abstract

What are the main findings?
The dimensions of the laser-induced crack layer can be controlled.The dimensions of the controlled cracks contribute to a decrease in grinding force and specific grinding energy.

The dimensions of the laser-induced crack layer can be controlled.

The dimensions of the controlled cracks contribute to a decrease in grinding force and specific grinding energy.

What are the implications of the main findings?
Controlling the dimensions of the laser-induced layer helps reduce material consumption in silicon–carbon splitting during separation processes.The grinding characteristics of the rough surface after silicon–carbon separation improve the quality of the ground surface.Pulsed-laser parameters play an important role in material separation.

Controlling the dimensions of the laser-induced layer helps reduce material consumption in silicon–carbon splitting during separation processes.

The grinding characteristics of the rough surface after silicon–carbon separation improve the quality of the ground surface.

Pulsed-laser parameters play an important role in material separation.

When grinding silicon carbide, surface and subsurface damage have a significant impact on the product’s surface quality. One method to control the crack dimensions is laser irradiation on the SiC surface. The effect of this method on the grinding process is analyzed in this study. A series of experiments was carried out based on an orthogonal experimental design, with systematic adjustments made to laser parameters, including pulse energy (current), laser spot spacing, scanning times, and grinding process parameters. During the experiments, the grinding force was monitored by a dynamometer, and the specific grinding energy was calculated accordingly. Pulsed engraving laser modification effectively reduced the hardness of the ceramic surface layer by about 20%. The median and radial crack sizes induced by the laser in the subsurface layer ranged from 20.4 μm to 54.3 μm. This effectively inhibited further propagation of median and radial cracks during the grinding processes. Simultaneously, the tangential grinding force Ft was reduced by 30%. These conclusions were obtained through corresponding experiments that link surface roughness to laser power and grinding parameters. Using laser-induced controllable crack characteristics in the grinding process allow damage from surface and subsurface grinding to be controlled in brittle materials.