# Substitution of Salt with Choline Chloride in Double-Layer Flatbreads: Impact on Technological Properties and Starch Digestibility

## TL;DR

This study explores replacing salt with choline chloride in gluten-free flatbreads to reduce sodium intake without affecting texture or starch digestion.

## Contribution

The novel use of choline chloride as a salt substitute in gluten-free flatbreads is proposed to lower glycemic index and mitigate hypertension risks.

## Key findings

- Gluten-free dough is harder than gluten dough due to gelatinized starch.
- Choline chloride substitution reduces starch hydrolysis in gluten-free flatbreads.
- Choline chloride does not affect flatbread texture but may lower glycemic index.

## Abstract

The association of sodium intake with hypertension has prompted the salt reduction in food processing. However, salt reduction is technologically challenging in process like breadmaking. The aim of this study was to identify the impact of salt reduction on the dough properties, technological characteristics and in vitro digestion on gluten and gluten-free flatbreads. In addition, the inclusion of choline chloride, (E 1001) as salt replacer (25% choline chloride substitution) was explored. Gluten-free dough exhibited higher hardness than gluten dough due to the predominance of gelatinized starch. Salt reduction gluten-free dough presented lower hardness because of the hydrophobicity of the rice proteins. The texture of the flatbreads was not affected by the addition of choline chloride, with control and choline chloride-enriched flatbreads showing similar strength and extensibility. Moreover, gluten-free flatbreads with choline chloride presented lower starch hydrolysis, because of the ionic compound (choline chloride) on starch gelatinization, which increases the viscosity of the system. In conclusion, gluten-free flatbread with choline chloride could represent a potential strategy to decrease the glycemic index and mitigate hypertension in consumers of gluten-free bread.

The online version contains supplementary material available at 10.1007/s11130-025-01459-9.