# Anisotropic Thermal Conductivity in Pellet-Based 3D-Printed Polymer Structures for Advanced Heat Management in Electrical Devices

## TL;DR

This paper shows how 3D printing with polymer pellets can create materials with directional heat conductivity, useful for managing heat in electronic devices.

## Contribution

The study introduces in situ control of filler orientation in 3D printing to achieve high thermal anisotropy and electrical insulation.

## Key findings

- Aligned fillers achieved 4.09 W/m·K thermal conductivity, 238% higher than perpendicular alignment.
- Materials maintained low dielectric loss, suitable for electrical insulation.
- Pellet-based printing enables unprecedented thermal anisotropy in polymer structures.

## Abstract

Efficient thermal management is critical for modern electrical and electronic devices, where increasing power densities and miniaturization demand advanced heat dissipation solutions. This study investigates anisotropic thermal conductivity in polymer structures fabricated via pellet-based fused granulate fabrication using polyamide 6 composite filled with thermally conductive, electrically insulative mineral fillers. Three sample orientations were manufactured by controlling the printing path direction to manipulate filler alignment relative to heat flow. The microscopic analysis confirmed a flake-shaped filler orientation dependent on extrusion direction. Thermal conductivity measurements using a guarded heat flow meter revealed significant anisotropy: samples with fillers aligned parallel to heat flow exhibited thermal conductivity of 4.09 W/m·K, while perpendicular alignment yielded 1.21 W/m·K, representing a 238% enhancement and an anisotropy ratio of 3.4. The dielectric measurements showed modest electrical anisotropy with maintained low dielectric loss below 0.05 at 1 kHz, confirming the suitability of the investigated materials for electrical insulation applications. The presented results demonstrate that pellet-based fused granular fabrication uniquely enables in situ control of platelet filler orientation during printing, achieving unprecedented thermal anisotropy, high through-plane thermal conductivity, and excellent electrical insulation in directly 3D-printed polymer structures, offering a breakthrough approach for advanced thermal management in electrical devices.