# Texture and Flexural Fatigue Resistance Governed by Surface-Dependent Deformation and Recrystallization in the Copper Foils

## TL;DR

This study shows how processing copper foils with specific grain sizes and textures improves their durability in flexible electronics.

## Contribution

The paper introduces a method to enhance copper foil fatigue resistance through controlled grain size and texture without aggressive cube enrichment.

## Key findings

- The center-interface layer achieved the highest flexural-fatigue life with cube content of 30–45% and grain size of 40–60 μm.
- Grain-size control reduces strain localization and improves slip compatibility during cyclic bending.
- Layer-dependent texture and grain size control can enhance flexural fatigue performance in copper foils.

## Abstract

High-flexibility copper foils are critical for reliable flexible interconnects and displays. In this work, commercial-purity copper belts were processed by triple-layer stacked cold rolling to ultrathin foils, producing distinct surface- and layer-dependent deformation structures in the bright, matte, and central-interface layers; subsequent annealing at 600 °C then promoted orientation-selective recrystallization. Under the present conditions, the center-interface layer of the triple-rolled foil achieved the highest flexural-fatigue life (≈8.0 × 104 cycles) within a window of cube ≈ 30–45% and grain size ≈ 40–60 μm. In this regime, grain-size control stabilizes intergranular slip compatibility, reduces elastic–plastic mismatch, and mitigates strain localization during cyclic bending. Even without aggressive cube enrichment, high flexural fatigue resistance can likewise be achieved through deliberate control of grain size. These findings establish a clear processing–microstructure–property linkage and indicate that layer-dependent control of texture and grain size can enhance flexural-fatigue performance in triple-layer stacked-rolled copper foils for flexible electronics.