Optimizing Acid Mist Suppression: Unraveling Surfactant Effects on Bubble Formation and Bursting Dynamics in Copper Electrowinning
Ashish Kakoria, Mirza Muhammad Zaid, Aamir Iqbal, Ellen Amoako Afful, Guang Xu

TL;DR
This study explores how surfactants reduce acid mist in copper electrowinning by examining bubble behavior, revealing that surfactant FC-1100 is particularly effective due to its impact on bubble dynamics.
Contribution
The study introduces a novel focus on bubble life cycle dynamics, including growth, propagation, and bursting, in the context of surfactant effects on acid mist suppression.
Findings
FC-1100 surfactant significantly reduces bubble terminal velocity and increases residence time in electrolyte.
FC-1100 generates bubbles with lower kinetic energy during rupture, enhancing acid mist suppression efficiency.
The study links bubble dynamics parameters like Weber and Ohnesorge numbers to surfactant effectiveness in mist suppression.
Abstract
The working mechanism of surfactant to reduce acid mist in copper electrowinning system is not well understood. Most of the studies are based on the surface tension reduction phenomenon but this is not the only function that causes acid mist reduction. In this paper, we investigated the effect of different surfactants on a bubble’s residence time, terminal velocity, flow regime, and bursting dynamics using a high-speed camera. We have evaluated five different surfactants and found that the presence of surfactants reduces the terminal velocity, bubble diameter, and increases the residence time of the bubble in electrolyte. Especially for FC-1100, the low terminal velocity and high residence time allowed the bubble to shift its flow regime to stokes flow and allow ample time for stabilization. This was dependent on the small Weber and Ohnesorge number when FC1100 was added, which means…
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Taxonomy
TopicsMetallurgical Processes and Thermodynamics · Corrosion Behavior and Inhibition · Electrodeposition and Electroless Coatings
