# Predictive Wafer-Scale Copper Nanowire Fabrication Using Template-Assisted On-Substrate Electrodeposition

## TL;DR

This paper introduces a scalable and cost-effective method for fabricating copper nanowires, enabling their use in advanced electronics and flexible devices.

## Contribution

A novel, low-cost, and scalable fabrication method for uniform copper nanowire arrays using template-assisted electrodeposition and predictive modeling.

## Key findings

- The method produces nanowires with diameters tunable from 100 to 1000 nm and length deviation below ∼20%.
- The nanowires form robust electromechanical interfaces with excellent adhesion and conductivity.
- The approach enables potential applications in high-density interconnects and wearable biosensors.

## Abstract

Precisely engineered metallic nanowire arrays offer a
compelling
solution for advanced electromechanical interconnects at room temperature,
crucial for applications ranging from flexible electronics to 3D integrated
circuits. However, their widespread adoption has been hindered by
complex and costly fabrication methods. This work reports a streamlined
and highly scalable route that overcomes these barriers, enabling
the growth of uniform nanowire arrays directly on semiconductor substrates.
Our method relies on template-assisted electrodeposition within a
simple two-electrode plating chamber. A key aspect of this approach
is the use of a melamine foam sponge, which applies uniform mechanical
pressure to ensure consistent template-substrate contact and promote
homogeneous growth. By combining this reliable synthesis with predictive
Monte Carlo modeling of the template morphology, we achieve exceptional
control over the final array geometry. Using copper as a model system,
our charge-based electrodeposition provides excellent control over
nanowire length and yields highly reproducible nanowires with diameters
tunable from 100 to 1000 nm and a typical length deviation below ∼20%
of the target. The practical utility of this method is validated by
demonstrating that these arrays form robust and resilient electromechanical
chip-to-chip bonding interfaces with excellent adhesion and conductivity.
By providing an accessible and low-cost foundation for producing high-quality
nanowires, this work significantly expands their potential for immediate
use. This opens up future avenues for developing advanced devices,
including high-density vertical interconnects, wearable biosensors,
and efficient energy harvesting systems.