Manufacturing and Application of Low-Cost Potting Adhesive with High Thermal Conductivity
Junxiang Wang, Shiwei Zhang, Caiman Yan, Hongming Li, Shubin Yin, Yong Tang

TL;DR
This paper introduces a low-cost, high thermal conductivity adhesive for improving heat dissipation in air-cored linear synchronous motors.
Contribution
A novel multi-scale filler strategy is proposed to significantly enhance the thermal conductivity of potting adhesives for motor windings.
Findings
The BN-AlN sample achieved a thermal conductivity of 1.182 W/m·K at 25 wt% filler loading.
The modified adhesive reduced winding temperature by 8.82 °C and improved temperature uniformity by 29.8%.
Abstract
The air-cored linear synchronous motor (ACLSM), characterized by high precision and stability, is widely applied in high-precision manufacturing. However, due to the absence of an iron core, the windings must be fixed with low thermal conductivity epoxy-based potting adhesive, leading to poor heat dissipation and significant temperature rise, which risks the motor’s lifespan and accuracy. To improve heat dissipation in ACLSM, this research proposes a multi-scale filler-based strategy to enhance the thermal conductivity of the adhesive. A series of comprehensive characterizations and thermal tests demonstrates the effectiveness of this approach. The results demonstrate that the BN-AlN sample exhibits superior thermal conductivity of 1.182 W/m·K at 25 wt% filler loading, a 48.7% enhancement over commercially adhesive 381-4DZ, with only a 38% increase in cost. Meanwhile, it possesses…
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Taxonomy
TopicsThermal properties of materials · Electronic Packaging and Soldering Technologies · Advanced MEMS and NEMS Technologies
