OpenAM-SimCCX: An Open-Source Framework for Thermo-Mechanical Analysis of Additive Manufacturing with CalculiX

TL;DR

OpenAM-SimCCX is an open-source tool for simulating additive manufacturing processes, helping to predict deformation and stress in 3D printed parts.

Contribution

The novel contribution is an open-source thermo-mechanical simulation framework for AM using CalculiX, enabling accessible and efficient analysis.

Findings

The framework captures laser–material interaction and scanning strategy effects in SLS processes.

Systematic comparisons show correlations between path planning, residual stress, and distortion.

Computational time analyses confirm the framework's efficiency and accessibility.

Abstract

Additive Manufacturing (AM) has emerged as a transformative technology for rapid prototyping and fabrication of geometrically complex structures. However, the inherent thermal cycling and rapid solidification in processes such as Selective Laser Sintering (SLS) frequently induce deformation and residual stresses, leading to dimensional deviations and potential premature failure. This paper presents OpenAM-SimCCX, an open-source workflow for finite element-based thermo-mechanical simulation of AM processes using CalculiX 2.21. The framework employs a time-dependent thermo-mechanical model with layer-by-layer element activation to capture key aspects of SLS, including laser–material interaction and scanning strategy effects. Systematic comparisons of different scanning strategies demonstrate clear correlations between path planning, residual stress distributions, and distortion, while computational time analyses confirm the framework’s efficiency. By providing comprehensive documentation, implementation guides, and open repositories, OpenAM-SimCCX offers an accessible and economically viable alternative to commercial software, particularly for academic institutions and small- to medium-sized enterprises. This framework advances open-source simulation tools for AM and promotes broader adoption in both research and industry.

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