# Sintering for High Power Optoelectronic Devices

## TL;DR

This paper explores copper-based sintering as a cost-effective alternative to gold-based soldering for optoelectronic devices.

## Contribution

A new particle-free copper ink is introduced and compared to existing sintering materials for thermal performance in optoelectronic submodules.

## Key findings

- Copper ink sintered interconnects achieved shear strengths above 31 MPa with uniform 2–5 µm layers.
- Copper ink interfaces matched silver interconnects in thermal performance at second level but lagged slightly at first level.
- Higher bonding pressure is needed for copper ink to address surface inhomogeneities compared to AuSn and silver.

## Abstract

Residual-free eutectic Au80Sn20 soldering is still the dominant assembly technology for optoelectronic devices such as high-power lasers, LEDs, and photodiodes. Due to the high cost of gold, alternatives are desirable. This paper investigates the thermal performance of copper-based sintering for optoelectronic submodules on first and second level to obtain thermally efficient thin bondlines. Sintered interconnects obtained by a new particle-free copper ink, based on complexed copper salt, are compared with copper flake and silver nanoparticle sintered interconnects and benchmarked against AuSn solder interconnects. The copper ink is dispensed and predried at 130 °C to facilitate in situ generation of Cu nanoparticles by thermal decomposition of the metal salt before sintering. Submounts are then sintered at 275 °C for 15 min under nitrogen with 30 MPa pressure, forming uniform 2–5 µm copper layers achieving shear strengths above 31 MPa. Unpackaged LEDs are bonded on first level using the copper ink but applying only 10 MPa to avoid damaging the semiconductor dies. Thermal performance is evaluated via transient thermal analysis. Results show that copper ink interfaces approach the performance of thin AuSn joints and match silver interconnects at second level. However, at first level, AuSn and sintered interconnects of commercial silver and copper pastes remained superior due to the relative inhomogeneous thickness of the thin Cu copper layer after predrying, requiring higher bonding pressure to equalize surface inhomogeneities.