# Data on mechanical and thermal properties of an amine-epoxy system at various post-curing temperatures

## TL;DR

This paper provides data on how post-curing temperatures affect the mechanical and thermal properties of an amine-epoxy system.

## Contribution

The study offers a dataset and analysis showing how post-curing influences epoxy properties for high-temperature applications.

## Key findings

- Post-curing increases the temperature range of the glassy state up to near Tg∞.
- ANOVA confirms statistically significant differences in properties at different post-curing temperatures.
- The approach ensures reproducible properties and minimizes curing kinetics influence.

## Abstract

The aim of this work is to provide a manufacture guide for producing a tailor-made amine-epoxy system that can operate at different services temperatures depending on the post-curing treatment. Therefore, a data set compilation of the mechanical and thermal properties of a commercial thermoset system (Epikure 3223 amine/Epon 828 epoxy) was obtained after exposure to a room temperature cure followed by different post-cures (80, 100, 120 °C), all below the fully cured glass transition temperature (Tg∞ ∼ 153 °C). The mechanical properties of this epoxy system were determined through dynamic mechanical analysis (DMA) and flexural testing, while its thermal behavior was evaluated by differential scanning calorimetry (DSC), thermomechanical analysis (TMA), and thermogravimetric analysis (TGA). The data was analyzed using analysis of variance (ANOVA) to assess if the selected post-curing temperatures provoke a statistically significant difference on the corresponding properties. This data highlights the importance of selecting an adequate post-curing process to extend the temperature range of the glassy state, ensuring reproducible mechanical and thermal properties up to temperatures close to Tg∞, which is key for high temperature applications in automotive, aeronautic, aerospace and construction. Furthermore, this approach guarantees that the curing kinetics would no longer influence the thermal history of this epoxy system.