Synthetic Electrospun Fiber Matrix in the Management of Acute Wounds Following Excision of Hidradenitis Suppurativa Lesions: A Prospective Pilot Study

TL;DR

A new synthetic fiber matrix combined with wound therapy helps heal difficult-to-treat skin wounds after hidradenitis suppurativa surgery.

Contribution

This study introduces a novel application of a synthetic electrospun fiber matrix to improve wound healing after hidradenitis suppurativa excision.

Findings

The average time to skin grafting was 14 ± 3.2 days.

Skin graft incorporation averaged 71 ± 28% with no complications observed.

Abstract

Hurley Stage II or III hidradenitis suppurativa (HS) may necessitate surgical excision of diseased skin and subcutaneous fat for symptom control and disease management. These excisions result in open wounds in topographically challenging regions and typically cannot be primarily closed. This study evaluates the use of a synthetic electrospun fiber matrix (SEFM) as a post-resection regeneration template to accelerate re-granulation and improve subsequent skin graft incorporation. This prospective pilot study enrolled Hurley Stage II or III patients undergoing surgical resection of HS lesions. SEFM was applied to the resulting wounds in conjunction with negative pressure wound therapy (NPWT). Patients were monitored post-operatively for granulation tissue formation and underwent skin grafting once granulation was sufficient. Skin graft incorporation was assessed at follow-up visits. Complications, including graft loss (partial or complete) and infection, were assessed at each encounter. A total of 21 wounds in eight patients met the inclusion criteria and were enrolled. The average time to skin grafting was 14 ± 3.2 days. After grafting, the average graft incorporation was 71 ± 28%. No complications occurred during the study. These initial results indicate that by supporting granulation tissue formation, combined use of SEFM and NPWT may aid in successful engraftment of topographically challenging areas post-HS excision.

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