# Experimental and Numerical Study of Laser Beam Welding of PBT-G30 for Electronic Housings in Automotive Applications

## TL;DR

This study explores laser welding techniques for joining plastic parts in automotive electronics, finding that a specific joint design significantly improves strength.

## Contribution

The study introduces a validated numerical model for predicting laser welding performance in complex joint configurations used in automotive applications.

## Key findings

- Butt-overlap joints showed 85% higher strength compared to purely overlapping joints.
- The numerical model accurately predicted experimental results, including displacement and force values.
- Minor deviations in model predictions were within the average experimental values and standard deviation.

## Abstract

This study investigates the application of laser spot welding to join protective housing components in the automotive electronics industry. The PBT GF 30 components were joined using two primary configurations: a purely overlapping joint and a top-overlap joint, both autogenous (i.e., without filler material). To complement the experimental analysis, a numerical model, previously validated for a simpler joint configuration, was adapted and applied to configurations beyond the overlapping and top-overlap joint, more representative of practical automotive industry components. The results demonstrated that butt-overlap joints exhibited significantly higher strength (85% increase) than purely overlapping joints. This enhancement is attributed to the combined effect of normal and shear stresses in the top-overlap configuration, whereas purely overlapping joints rely solely on shear stress. The validated numerical model accurately predicted the experimental results, including displacement and force values. While minor deviations were observed, the numerical model’s predictions converged within the average experimental values and standard deviation, demonstrating that such a model can be used to precisely design laser-welded joints for similar applications.