Topographic, Thermal and Chemical Characterization of Oxidized Cu and Cu-Ag Thin Films
Maria C. Carrupt, Ana M. Ferraria, Ana P. Serro, Ana P. Piedade
TL;DR
This study explores how adding silver to copper thin films affects their surface properties and thermal performance after aging and heat treatment.
Contribution
The study introduces a method to enhance the thermal stability of copper thin films through controlled silver doping.
Findings
Silver doping and heat treatment altered surface roughness and morphology of copper thin films.
Lower silver concentrations increased thermal conductivity, but aging and annealing effects varied with silver content.
Cu_4Ag films showed the best thermal stability after natural aging.
Abstract
This study investigated the effects of silver doping, natural ageing, and thermal-induced oxidation on the surface chemistry, morphology, and thermal performance of copper thin films. Ag is used as a doping element in Cu because, in bulk materials it usually refines microstructures, leading to increased hardness and mechanical strength through mechanisms such as solid solution strengthening and twinning. In this work was also used due to its oxidation resistance. Thin films of pure and silver-doped copper (Cu_2Ag and Cu_4Ag) were deposited by RF magnetron sputtering and characterized as-deposited, naturally aged, at room temperature and humidity for one year, and thermally treated at 200 °C, in air. The characterization included X-ray photoelectron spectroscopy (XPS), Atomic Force microscopy (AFM), and thermal analysis, specifically thermal conductivity (λ), thermal diffusivity (α), and…
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Taxonomy
TopicsCopper Interconnects and Reliability · Electronic Packaging and Soldering Technologies · ZnO doping and properties