Analysis of Subsurface Damage Based on K9 Glass Grinding
Yao Liu, Jingjing Xie, Ruiliang Li, Jiankun Gao, Ming Li, Lin Sun
TL;DR
This paper studies how grinding K9 glass affects surface and subsurface damage and proposes an improved etching method to analyze subsurface damage depth.
Contribution
An improved HF chemical etching method is proposed to model subsurface damage depth based on grinding parameters.
Findings
Planetary grinding with bonded abrasives affects surface quality based on abrasive grain size and pressure.
A differential etching method correlates subsurface damage depth with grinding parameters and surface roughness.
Abstract
During the grinding process of K9 glass, various forms of surface damage—such as indentations and pitting—as well as subsurface damage—including cracks and residual stress—are generated. This paper focuses on the planetary grinding method utilizing bonded abrasives for both process research and subsurface damage detection. It examines the timeliness of grinding duration and analyzes the effects of abrasive grain size and grinding pressure on surface quality. Building upon the principle of differential etching, an improved HF chemical etching method is proposed to establish a relationship model that correlates the depth of subsurface damage with abrasive grain size, applied pressure, and surface roughness.
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Taxonomy
TopicsAdvanced Surface Polishing Techniques · Advanced machining processes and optimization · Laser Material Processing Techniques