# Through Silicon MEMS Inspection with a Near-Infrared Laser Scanning Setup

## TL;DR

This paper introduces a non-destructive method using a near-infrared laser to inspect silicon-encapsulated MEMS devices without damaging them.

## Contribution

A novel laser scanning setup for non-destructive inspection of silicon-encapsulated MEMS using near-infrared light.

## Key findings

- The method successfully detects small features using transmitted light intensity variations in the near-infrared spectrum.
- The setup was experimentally validated on a MEMS latching device, showing good agreement with theoretical predictions.

## Abstract

The inspection of encapsulated MEMS devices typically relies on destructive methods which compromise the structural integrity of samples. In this work, we present the concept and preliminary experimental validation of a laser scanning setup to non-destructively inspect silicon-encapsulated microstructures by measuring small variations of transmitted light intensity in the near-infrared spectrum. This method does not require any particular sample preparation or damage, and it is based on the higher degree of transparency of silicon in the near-infrared and the transmission contrast resulting from the Fresnel reflections observed at the interfaces between the different materials of the MEMS device layers. We characterise the small feature resolving performance of the laser scanning setup using standard targets, and experimentally demonstrate the inspection of a MEMS latching device enclosed within silicon covers, comparing the contrast measurements with theoretical predictions.