# Effect of Copper in Gas-Shielded Solid Wire on Microstructural Evolution and Cryogenic Toughness of X80 Pipeline Steel Welds

**Authors:** Leng Peng, Rui Hong, Qi-Lin Ma, Neng-Sheng Liu, Shu-Biao Yin, Shu-Jun Jia

PMC · DOI: 10.3390/ma18153519 · Materials · 2025-07-27

## TL;DR

Adding copper to welding wire reduces toughness in X80 pipeline steel welds at low temperatures.

## Contribution

Demonstrates how copper content affects microstructure and cryogenic toughness in X80 pipeline steel welds.

## Key findings

- Increasing Cu content reduces acicular ferrite volume by ~20%.
- Cryogenic impact energy drops from 221.08 J to 151.59 J with higher Cu.
- Crack propagation angle decreases, reducing low-temperature toughness.

## Abstract

This study systematically evaluates the influence of copper (Cu) addition in gas-shielded solid wires on the microstructure and cryogenic toughness of X80 pipeline steel welds. Welds were fabricated using solid wires with varying Cu contents (0.13–0.34 wt.%) under identical gas metal arc welding (GMAW) parameters. The mechanical capacities were assessed via tensile testing, Charpy V-notch impact tests at −20 °C and Vickers hardness measurements. Microstructural evolution was characterized through optical microscopy (OM), scanning electron microscopy (SEM) and electron backscatter diffraction (EBSD). Key findings reveal that increasing the Cu content from 0.13 wt.% to 0.34 wt.% reduces the volume percentage of acicular ferrite (AF) in the weld metal by approximately 20%, accompanied by a significant decline in cryogenic toughness, with the average impact energy decreasing from 221.08 J to 151.59 J. Mechanistic analysis demonstrates that the trace increase in the Cu element. The phase transition temperature and inclusions is not significant but can refine the prior austenite grain size of the weld, so that the total surface area of the grain boundary increases, and the surface area of the inclusions within the grain is relatively small, resulting in the nucleation of acicular ferrite within the grain being weak. This microstructural transition lowers the critical crack size and diminishes the density for high-angle grain boundaries (HAGBs > 45°), which weakens crack deflection capability. Consequently, the crack propagation angle decreases from 54.73° to 45°, substantially reducing the energy required for stable crack growth and deteriorating low-temperature toughness.

## Linked entities

- **Chemicals:** Copper (PubChem CID 23978)

## Full-text entities

- **Chemicals:** Copper (MESH:D003300), X80 (-), ferrite (MESH:C001215)

## Full text

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## Figures

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## References

42 references — full list in the complete paper: https://tomesphere.com/paper/PMC12348845/full.md

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Source: https://tomesphere.com/paper/PMC12348845