The Influence of h-BN Distribution Behavior on the Electrothermal Properties of Bismaleimide Resin

TL;DR

This paper studies how the distribution of h-BN in bismaleimide resin affects the material's thermal and electrical properties for electronic packaging.

Contribution

The study introduces a method using multi-scale filler control and gradient filling to enhance thermal conductivity in composites.

Findings

h-BN with a 10 μm diameter showed the most significant improvement in thermal conductivity.

At 40 wt% h-BN filling, the thermal conductivity reached 1.31 W/(m·K).

Poor interface connections between polymer and filler increase phonon scattering, reducing thermal conductivity.

Abstract

Thermal conductive composite materials have excellent electrical insulation properties, low cost, and are lightweight, making them a promising alternative to traditional electronic packaging materials and enhancing the heat dissipation of integrated circuits. Due to the differences in specific surface area and volume, thermal conductive fillers have poor interface connections between the polymer and/or thermal conductive filler, thereby increasing phonon scattering and affecting thermal conductivity. This article uses bismaleimide resin as the matrix and h-BN as the thermal conductive filler. The evolution laws of thermal conductivity and dielectric properties of thermal conductive composite materials were systematically characterized through multi-scale filler control and gradient filling design. Among them, h-BN with a diameter of 10 μm has the most significant improvement in thermal conductivity. When the filling amount is 40 wt%, the thermal conductivity reaches 1.31 W/(m·K).

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