# Method for Elucidating the Structural Evolution of a Nanoscale Release Layer in Double Copper Foils Under Thermal Exposure

## TL;DR

This paper presents a method to study how a nanoscale layer in copper foils changes under heat, which affects its release strength.

## Contribution

A new characterization methodology is introduced to study the structural evolution of a chromium-based release layer in copper foils.

## Key findings

- Thermal exposure causes oxidation of the release layer at the interface with copper.
- Release strength increases significantly from 5.9 N/m to 163 N/m after heating.
- XPS, AFM, and TEM were used to identify structural transformations in the release layer.

## Abstract

Double ultrathin copper foils (DTH), widely used for producing conductive tracks in electronics, consist of an ultrathin copper functional foil (FF), a nanometric release layer (RL), and an ultrathin copper carrier foil (CF). Achieving stable release strength of the CF during DTH lamination remains a key challenge, largely due to limited knowledge about the structure of the RL. In this study, a comprehensive characterization methodology is proposed to investigate the physico-chemical structure of a chromium-based RL, both before and after thermal exposure at 230 °C. Peel-off testing, X-ray photoelectron spectroscopy (XPS), atomic force microscopy (AFM), and transmission electron microscopy (TEM) were employed. The main structural transformation identified is the oxidation of the RL at the FF–RL interface, resulting in the formation of a chromium oxide layer. This transformation may underlie the significant increase in release strength, which rises from 5.9 N/m before thermal exposure to 163 N/m afterward.