Cam Design and Pin Defect Detection of Cam Pin Insertion Machine in IGBT Packaging
Wenchao Tian, Pengchao Zhang, Mingfang Tian, Si Chen, Haoyue Ji, Bingxu Ma
TL;DR
This paper presents an automated pin insertion machine for IGBT modules, improving productivity and quality in semiconductor packaging.
Contribution
A novel pin insertion machine with cam design and image-based defect detection for IGBT packaging is developed and tested.
Findings
The pin insertion machine achieved a 99.75% pass rate for pin insertion.
The average insertion time per pin was 2.84 seconds with 0.02 mm guidance accuracy.
The pin cutting pass rate reached 97% with defect detection using image algorithms.
Abstract
Packaging equipment plays a crucial role in the semiconductor industry by enhancing product quality and reducing labor costs through automation. Research was conducted on IGBT module packaging equipment (an automatic pin insertion machine) during the pin assembly process of insulated gate bipolar transistor (IGBT) modules to improve productivity and product quality. First, the manual pin assembly process was divided into four stages: feeding, stabilizing, clamping, and inserting. Each stage was completed by separate cams, and corresponding step timing diagrams are drawn. The profiles of the four cams were designed and verified through theoretical calculations and kinematic simulations using a seventh-degree polynomial curve fitting method. Then, image algorithms were developed to detect pin tilt defects, pin tip defects, and to provide visual guidance for pin insertion. Finally, a pin…
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Taxonomy
TopicsMetallurgy and Material Forming · Advanced Machining and Optimization Techniques · Industrial Vision Systems and Defect Detection