# Flame Retardance and Antistatic Polybutylene Succinate/Polybutylene Adipate-Co-Terephthalate/Magnesium Composite

## TL;DR

Researchers created biodegradable polymer composites with improved flame resistance and antistatic properties for use in sustainable electronic packaging.

## Contribution

The study introduces a novel composite material combining PBS, PBAT, MgO, and epoxy with enhanced flame retardance and antistatic performance.

## Key findings

- The PBS/E1/PBAT/MgO 15% composite achieved a V-1 flame retardancy rating.
- Adding 1% epoxy increased tensile strength from 19 MPa to 25 MPa.
- Plasma sputtering outperformed sparking in antistatic properties due to consistent metal nanoparticle distribution.

## Abstract

Antistatic and anti-flame biodegradable polymer composites were developed by melt-blending polybutylene succinate (PBS) with epoxy resin, polybutylene adipate-co-terephthalate (PBAT), and MgO particles. The composite films were prepared using a two-roll mill and an extrusion-blown film machine. Plasma and sparking techniques were used to improve the antistatic properties of the composites. The PBS/E1/PBAT/MgO 15% composite exhibited an improvement in V-1 rating of flame retardancy, indicating an enhancement in the flame retardancy of biodegradable composite films. The tensile strength of the PBS/PBAT blend increased from 19 MPa to 25 MPa with the addition of 1% epoxy due to the epoxy reaction increasing compatibility between PBS and PBAT. The PBS/E1/PBAT and PBS/E1/PBAT blends with MgO 0, 0.5, and 1% showed increases in the contact angle to 80.9°, 83.0°, and 85.7°, respectively, because the epoxy improved the reaction between PBS and PBAT via the MgO catalyst effect. Fourier-transform infrared spectroscopy confirmed the reaction between the epoxy groups of the epoxy resin and the carboxyl end groups of PBS and PBAT by new peaks at 1246 and 1249 cm−1. Plasma technology (sputtering) presents better antistatic properties than the sparking process because of the high consistency of the metal nanoparticles on the surface. This composite can be applied for electronic devices as sustainable packaging.