# Liquid-State Interfacial Reactions of Lead-Free Solders with FeCoNiCr and FeCoNiMn Medium-Entropy Alloys at 250 °C

## TL;DR

This study examines how different alloys react with lead-free solders at high temperatures, revealing how alloy composition affects solder joint stability and wettability.

## Contribution

The paper identifies how specific elements in medium-entropy alloys influence intermetallic compound formation and solder wettability during interfacial reactions.

## Key findings

- Mn in alloys promotes finer intermetallic compound formation during solder reactions.
- Cr facilitates spalling of larger intermetallic particulates in Sn/FeCoNiCr systems.
- Cu doping in SAC305 solder enhances nucleation and stabilizes fine intermetallic particles.

## Abstract

This study investigates the interfacial reactions of FeCoNiCr and FeCoNiMn medium-entropy alloys (MEAs) with Sn and Sn-3Ag-0.5Cu (SAC305) solders at 250 °C. The evolution of interfacial microstructures is analyzed over various aging periods. For comparison, the FeCoNiCrMn high-entropy alloy (HEA) is also examined. In the Sn/FeCoNiCr system, a faceted (Fe,Cr,Co)Sn2 layer initially forms at the interface. Upon aging, the significant spalling of large (Fe,Cr,Co)Sn2 particulates into the solder matrix occurs. Additionally, an extremely large, plate-like (Co,Ni)Sn4 phase forms at a later stage. In contrast, the Sn/FeCoNiMn reaction produces a finer-grained (Fe,Co,Mn)Sn2 phase dispersed in the solder, accompanied by the formation of the large (Co,Ni)Sn4 phase. This observation suggests that Mn promotes the formation of finer intermetallic compounds (IMCs), while Cr facilitates the spalling of larger IMC particulates. The Sn/FeCoNiCrMn system exhibits stable interfacial behavior, with the (Fe,Cr,Co)Sn2 layer showing no significant changes over time. The interfacial behavior and microstructure are primarily governed by the dissolution of the constituent elements and composition ratio of the HEAs, as well as their interactions with Sn. Similar trends are observed in the SAC305 solder reactions, where a larger amount of fine (Fe,Co,Cu)Sn2 particles spall from the interface. This behavior is likely attributed to Cu doping, which enhances nucleation and stabilizes the IMC phases, promoting the formation of finer particles. The wettability of SAC305 solder on MEA/HEA substrates was further evaluated by contact angle measurements. These findings suggest that the presence of Mn in the substrate enhances the wettability of the solder.