# Study on the Preparation and Properties of Thermally Conductive Semi-Aromatic Heat-Resistant PA5T-CO-10T/ Hexagonal Boron Nitride Composites

## TL;DR

This study introduces a new composite material with high thermal conductivity and heat resistance, suitable for electronics and automotive applications.

## Contribution

A novel PA5T-CO-10T/hexagonal boron nitride composite with significantly enhanced thermal conductivity is developed.

## Key findings

- The composite's thermal conductivity increases significantly with higher hexagonal boron nitride content.
- At 30 wt% hexagonal boron nitride, thermal conductivity is 2.5 times higher than the original matrix.
- The composite shows improved mechanical and thermal properties due to enhanced molecular chain connectivity.

## Abstract

In this paper, we report a novel thermally conductive semi-aromatic heat-resistant PA5T-CO-10T/hexagonal boron nitride (PA5T-CO-10T/BN) composite, based on as-synthesized PA5T-CO-10T, which is a copolymer of poly (pentamethylene terephthalamide) (PA5T) and poly (decamethylene terephthalamide) (PA10T). We confirmed the structure of PA5T-CO-10T through a nuclear magnetic resonance carbon spectrometer (13C-NMR). The differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA) results indicate that PA5T-CO-10T demonstrates a processing window (greater than 90 °C) which is suitable for melt processing and injection molding. Moreover, the PA5T-CO-10T composites with different BN contents were tested by scanning electron microscopy (SEM), a thermal conductivity meter, a rotational rheometer and X-ray diffraction (XRD). The results indicate that as the content of h-BN increases, the thermal conductivity of the PA5T-CO-10T/BN composites is significantly enhanced. When the mass of h-BN reaches 30 wt%, the thermal conductivity of the composite material is 2.5 times that of the original matrix resin. Simultaneously, there is a notable upward trend observed in the storage modulus, loss modulus, complex viscosity and orientation degree of h-BN. This is attributed to the high thermal conductivity and the high orientation degree of h-BN, which ensure the continuous enhancement of the material’s thermal conductivity. Additionally, the introduction of h-BN enhances the degree of connection between the material’s molecular chains. PA5T-CO-10T/BN possesses excellent heat resistance and thermal conductivity, presenting significant application prospects in the fields of electronics, electrical appliances and automobiles.