# Design and Validation of a Dielectric Method-Based Composite Material Curing Monitoring Platform

## TL;DR

This paper introduces a new platform for monitoring the curing of composite materials using dielectric methods, showing reliable and accurate results.

## Contribution

The novel contribution is a dielectric method-based platform for composite curing monitoring with high correlation to DSC tests.

## Key findings

- Multiple ionic viscosity curves show consistent trends with correlation coefficients over 0.96.
- Curing index changes align with curing degree, validating the platform's accuracy.
- The platform effectively monitors ionic viscosity during composite repair patch curing.

## Abstract

Monitoring the curing process is crucial for guiding and optimizing the curing procedures of composite material repair patches. Traditional embedded online monitoring methods are limited in their ability to track the curing process of these patches. This paper presents a composite material curing monitoring platform designed using dielectric methods. It integrates temperature control, pressure control, dielectric signal acquisition, control and display modules, and is specifically tailored for bag molding curing of repair patches. The platform measures the ionic viscosity of T300 2019B composites, analyzes the curing index, and correlates it with DSC-cured degree tests. The results indicate that the multiple ionic viscosity curves obtained from monitoring exhibit consistent trends, with correlation coefficients between curves exceeding 0.96. The changes in curing index align with the changes in curing degree, demonstrating that the platform can reliably and accurately monitor the ionic viscosity of repair patches. This platform enables effective monitoring of the ionic viscosity during the curing process of composite material repair patches.