# Study of Application of an Active Ultrasound by Use of Zn-Al-Mg-Ti-Based Solder on Selected Substrates

## TL;DR

This study explores how a special zinc-based solder with ultrasound improves bonding on ceramic and copper surfaces for high-temperature uses.

## Contribution

The novel use of Zn-Al-Mg-Ti-based active solder with ultrasound for enhanced soldering of ceramics and copper is investigated.

## Key findings

- The solder shows improved wettability and bond strength when activated by ultrasound.
- Microstructural and phase analysis reveals suitable properties for high-temperature applications.
- The study provides insights into active soldering mechanisms for electronic and structural uses.

## Abstract

This study investigates the potential application of Zn5Al1.5Mg1.5Ti active solder in ultrasonic soldering of Al2O3 ceramics and Cu substrates. The research explores the microstructural characteristics, phase composition, and mechanical properties of the solder and the resulting joints. Particular attention is given to the formation mechanisms of the solder–substrate bond and the role of ultrasound activation in enhancing wettability and bond strength. The study aimed to provide a deeper understanding of active soldering processes and their suitability for high-temperature applications. The findings contribute to advancing lead-free soldering technologies for electronic and structural applications.