# Innovative Fluorinated Polyimides with Superior Thermal, Mechanical, and Dielectric Properties for Advanced Soft Electronics

## TL;DR

This paper introduces a new type of fluorinated polyimide with excellent thermal, mechanical, and dielectric properties for use in advanced soft electronics like wearable devices.

## Contribution

The study presents a novel molecular design using trifluoromethylbenzene to enhance polyimide performance for high-frequency and high-temperature applications.

## Key findings

- TPPI50 shows a glass transition temperature of 402 °C and thermal decomposition temperature of 563 °C.
- The material achieves a dielectric constant of 2.312 and dielectric loss of 0.00676 at 1 MHz.
- TPPI50 outperforms conventional polyimides in thermal, mechanical, and dielectric properties.

## Abstract

This study addresses the limitations of traditional polyimides (PIs) in high-frequency and high-temperature soft electronic applications, and then introducing trifluoromethylbenzene (TFMB) into the molecular structure and employing various diamines as connecting components to solve the bottleneck. The innovative molecular design enhances thermal, mechanical, and dielectric properties, overcoming challenges in balancing these performances. The optimized fluorinated PI (TPPI50) exhibits exceptional properties, including a glass transition temperature of 402 °C, thermal decomposition temperature of 563 °C, tensile strength of 232.73 MPa, elongation at break of 26.26%, and dielectric constant of 2.312 at 1 MHz with a dielectric loss as low as 0.00676. These improvements are attributed to the unique synergy between TFMB’s fluorinated groups, which reduce molecular polarization, and the biphenyl structure, which reinforces chain stability. Compared to conventional PIs, TPPI50 demonstrates superior comprehensive performance, making it highly suitable for soft circuits, high-frequency signal transmission, and advanced applications such as wearable devices and biosensors. This study provides a robust framework for industrial applications, offering a path to next-generation soft electronics with enhanced reliability and performance.