Silver–Organic Complex in Photosensitive Silver Pastes for Enhanced Resolution and Aspect Ratio
Jyun-Hao Chen, Yen-Ting Liu, Chia-Chun Hsieh, Yi-Cheng Chou, Chun-Hu Chen
TL;DR
This paper introduces a new photosensitive silver paste using silver oxalate to improve resolution and aspect ratio in printed electronics.
Contribution
The use of silver oxalate as a molecular precursor reduces undercutting and enables multilayer stacking for higher resolution patterning.
Findings
Replacing 25% of silver powder with silver oxalate achieves line widths as fine as 10 μm.
A three-layer stack of the modified paste reaches an aspect ratio with 29.4 μm height and 10 μm line width.
Silver oxalate slightly increases line width due to light scattering from nanoparticles formed during decomposition.
Abstract
Traditional screen printing is an easy approach commonly used for conductive pattern fabrication of electronics but lacks high resolution. Photolithography offers better resolution but is complex. Photosensitive silver pastes (PSP) combine the benefits of both but suffer from undercut issues, causing uneven etching, decreased interfacial adhesion, and thus poor resolutions. In this study, we explore the use of molecular precursors (i.e., silver oxalate) to replace metallic silver particles and enhance the depth of light penetration. Our findings demonstrate a successful solution to the undercut issue, achieving an undercut index of 1.0, indicating an undercut-free scenario and enabling higher resolutions in line and pattern formation. Additionally, our research confirms the feasibility of multilayer stacking of photosensitive pastes, achieving unprecedented aspect ratios in line…
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Taxonomy
TopicsAdvanced Sensor and Energy Harvesting Materials · Nanomaterials and Printing Technologies · ZnO doping and properties