# Metal–organic framework adhesives with exceptionally high heat resistance

## TL;DR

Researchers created high-heat-resistant adhesives using metal–organic frameworks, which can withstand temperatures up to 700°C without degrading.

## Contribution

The study introduces ZIF-67-based adhesives with exceptional heat resistance due to their stable structure at high temperatures.

## Key findings

- ZIF-67-based adhesives showed heat resistance up to 700°C in nitrogen atmospheres.
- The adhesive's stability is due to the formation of a qtz phase without voids at high temperatures.
- These adhesives are comparable to conventional high-heat-resistant polymer adhesives.

## Abstract

We synthesized high-heat-resistant adhesives based on metal – organic frameworks owing to their high decomposition temperature and the absence of a glass transition. Heat-resistance tests were performed on adhesive joints consisting of zeolitic imidazolate framework (ZIF)-67-based adhesives and a copper substrate. The as-synthesized ZIF-67-based adhesive exhibited heat resistances at 600 and 700°C in air and nitrogen atmospheres, respectively, comparable to those of conventional high-heat-resistant polymer-based adhesives. The degradation mechanism of the ZIF-67 adhesives was investigated, and their high heat resistance was attributed to the stable existence of the ZIF-67 qtz phase in the adhesive layer at high temperatures without the formation of voids. Thus, adhesives based on ZIF-67 and other metal – organic frameworks can be applied in high-temperature industrial systems.

By focusing on its high thermal stability and absence of glass transition, the ZIF-67 gel was found to have high potential that is comparable to existing heat-resistant adhesives.